X-Spection 1860
Versatile offline X-ray inspection system with high-resolution imaging for comprehensive circuit board defect detection and quality assurance.
Product Overview
The Scienscope X-Spection 1860 delivers high-resolution X-ray imaging for batch inspections of complex circuit boards. With its 90kV sealed microfocus tube and 5" × 5" flat panel detector, the system provides detailed statistics to help improve SMT line processes. It is an excellent tool for inspecting multilayer PCBs, BGA voids, barrel fill (THT), and other hidden solder joint defects.
The 45° tilt capability (optional 70°) allows oblique-angle views for thorough solder joint analysis, while the mapping camera enables precise close-up image capture. Distributed and supported by TIIHTRONICS across Mexico and Texas.
Key Features
- Fully integrated 90kV microfocus sealed X-ray tube with 5µm spot size
- 5" × 5" flat panel detector — 1536 × 1536 px, 16-bit, 85µm pixel size
- 45° tilting angle (optional 70° configuration)
- Mapping camera for close-up image capture
- Advanced void percentage calculation with improved background definition
- Enhanced BGA tool that reduces false alarms
- Fiducial mark recognition and BGA measuring capabilities
- Optional barcode / laser scanner integration
- Stepper motor positioning with CNC-style programmability
- Windows 11 industrial PC platform
Technical Specifications
| X-Ray Tube | 90kV sealed microfocus, 5µm spot size |
| Detector | 5" × 5" flat panel, 1536 × 1536 px, 16-bit, 85µm pixel |
| Detection Range | 400 × 460 mm |
| Tilt Angle | 45° standard (70° optional) |
| Dimensions (W×D×H) | 950 × 1,630 × 2,170 mm |
| Weight | 1,300 kg |
| Power | AC 110–240V, 50/60Hz |
| OS | Windows 11 |
