ERSASCOPE X
Versatile optical inspection system for evaluating solder joints on PCBs — 5MP N-MOS color camera with dual quick-change objectives, BGA optics and Ersa ImageDoc v3 inspection software.
Product Overview
The Ersa ERSASCOPE X is a versatile optical inspection system developed for digital image capture and evaluation of solder joints on printed circuit boards. Whether inspecting SMT or THT solder connections, PCB surfaces, or solder paste prints, the ERSASCOPE X delivers clear, high-resolution imagery for reliable quality assessment.
The system features a 5-megapixel N-MOS color camera with USB 2.0 connectivity, paired with dual quick-change objectives: a 90° BGA optics head with approximately 280µm gap clearance for inspecting concealed solder joints beneath components, and a 0° macrozoom lens for general surface inspection and documentation tasks.
Integrated dimmable LED lighting with an additional gooseneck light source ensures optimal illumination for any inspection scenario. All images are captured and documented through the Ersa ImageDoc v3 inspection software, which includes Focus Fusion capability for enhanced depth-of-field imaging — combining multiple focal planes into a single sharp image for thorough solder joint documentation.
Key Features
- 5-megapixel N-MOS color image sensor with USB 2.0 connectivity
- Dual quick-change objectives: 90° BGA optics and 0° macrozoom lens
- 90° BGA optics with ~280µm gap clearance for concealed solder joint inspection
- Integrated dimmable LED lighting (0–100% brightness control)
- Additional gooseneck light source for flexible illumination
- Height-adjustable, swiveling tripod with extendable Z-axis and fine adjustment
- 320mm diameter inspection table with fine adjustment and 4 PCB support feet
- Built-in 3mm lens with focus adjustment ring on camera unit
- Ersa ImageDoc v3 inspection software (basic version included)
- Focus Fusion capability for enhanced depth-of-field imaging
- Lightweight mobile scope unit (approx. 210g) for versatile positioning
- Antistatic-capable construction
- Suitable for SMT, THT, PCB surface and solder paste inspection
Technical Specifications
| Tripod Assembly | |
|---|---|
| Dimensions (L×W×H) | 480 × 550 × 400 mm |
| Weight | Approx. 9 kg |
| Materials | Aluminum, stainless steel, plastic |
| Adjustment | Height-adjustable, swiveling, extendable Z-axis with fine adjustment |
| ESD Protection | Antistatic capable |
| Camera Unit (Mobile Scope) | |
| Image Sensor | 1/3″ N-MOS color |
| Resolution | 5.0 MP |
| Dimensions | 114 × 36 × 51 mm (without cable) |
| Weight | Approx. 210 g |
| Built-in Lens | 3 mm with focus adjustment ring |
| LED Control | Integrated, 0–100% dimmable |
| Connectivity | USB 2.0 |
| Inspection Table | |
| Diameter | 320 mm |
| Weight | Approx. 5 kg |
| Features | Fine adjustment, 4 PCB support feet |
| LED Light Source | |
| Dimensions | 170 × 196 × 98 mm |
| Weight | Approx. 2.1 kg |
| Software | |
| Inspection Software | Ersa ImageDoc v3 (basic version) |
| Special Features | Focus Fusion depth-of-field imaging |
