XCEED – 3D AOI
Industry’s fastest 3D automated optical inspection system with laser line scanning for real 3D imaging and unmatched defect detection accuracy.
Product Overview
The PARMI Xceed is a next-generation 3D Automated Optical Inspection (AOI) system engineered for high-volume electronics manufacturing. Built on PARMI’s proprietary laser line scan methodology, the Xceed generates true 3D image data—capturing precise height and dimensional measurements of every component, solder joint, and surface detail on a PCB. This real 3D approach eliminates the limitations of traditional 2D inspection systems, which rely on color and contrast and are prone to false calls caused by surface variations.
The Xceed performs comprehensive, multi-category defect detection without additional cycle time. The system inspects regardless of component color, material composition, or surface roughness, making it equally reliable across diverse board assemblies. With the capability to inspect components up to 65mm in height, the Xceed handles everything from low-profile chip capacitors to tall connectors and shielded modules—all at the fastest inspection speed in the industry.
Beyond standard component and solder inspection, the Xceed also detects foreign material contamination and measures PCB warpage in the same pass, providing a holistic quality assessment in a single inspection cycle. This consolidation reduces line complexity, increases throughput, and ensures no defect category is overlooked. Distributed and supported by TIIHTRONICS across Mexico and Texas.
Key Features
- Real 3D image acquisition using laser line scan technology for true height measurement
- Fastest inspection speed in the industry for high-volume production lines
- Material-independent inspection — accurate regardless of color, material, or surface roughness
- 65mm height inspection capability for tall connectors and complex assemblies
- Comprehensive solder joint analysis detecting bridging, insufficient solder, and quality issues
- Component defect detection: missing parts, misalignment, wrong parts, tombstoning
- Lead inspection covering lead lift, lead missing, and lead offset conditions
- OCR/OCV text verification for component marking validation and traceability
- Pin inspection and coplanarity measurement for connectors and fine-pitch components
- Foreign material and contamination detection within the standard inspection cycle
- PCB warpage measurement without additional cycle time
- Backed by TIIHTRONICS local service, training & support in Mexico and Texas
