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3D Inspection Systems (SPI & AOI)
PARMI
PARMI is a global leader in 3D solder paste inspection (SPI) and automated optical inspection (AOI). Their SIGMA X and XCEED platforms deliver unmatched accuracy for quality control in high-volume SMT production lines.
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PARMI Product Line
SIGMA X – 3D SPI
High-speed laser line scan 3D solder paste inspection with real 3D measurement and closed-loop feedback.
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XCEED – 3D AOI
Industry’s fastest 3D AOI with laser line scanning, 65mm height capability, and material-independent detection.
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XCEED MP – Multi-Purpose 3D AOI
Component, solder, and conformal coating inspection in one software-configurable machine.
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XCEED BSI – Bottom Side Inspection
High-speed 3D bottom-side inspection with laser line scan—no board flipping required.
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PCI 100 – Conformal Coating Inspection
Automated conformal coating inspection and verification system.
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