Inline Vacuum-Reflow Systems

Product Overview

The SMT Wertheim V-Series Inline Vacuum-Reflow Systems combine proven reflow soldering technology with an integrated vacuum stage to achieve void reduction of up to 99% in critical solder joints. The stainless steel vacuum chamber with individually adjustable vacuum parameters enables precise control over the evacuation process, ensuring the highest quality connections for demanding applications in life support systems, aircraft control electronics, automotive ADAS, and other safety-critical assemblies.

Featuring a powerful 300 m³/h vacuum pump and cycle-based evacuation, the V-Series processes products up to 100 mm in length with a transport capacity of 10 kg/m. The systems support both 2-lane and 3-lane transport configurations, allowing flexible production layouts that maximize throughput while maintaining the tightest process control. Continuous center support via a tab link chain ensures stable product transport throughout the entire reflow and vacuum process.

Five models span heating zone lengths from 2.9 m to 6.3 m, covering applications from compact prototype lines to high-volume production environments. All systems are nitrogen-capable and share the same energy-efficient design philosophy as the R-Series reflow ovens, with optimized process gas management and low-maintenance operation that minimizes production downtime.